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High‑Tech Chip Fab Delivered with Collaborative Effort

Fab D1D

A collaborative effort delivered this 300mm wafer fabrication plant in just 12 months. This facility is used to develop 65 nanometer processors for the next generation of high-tech chips. Managing a field force that peaked at 1800 workers, Hoffman built over 150,000 SF of Class One and Ten cleanroom space, as well as associated office and support spaces. Self-performing the concrete and mechanical work, Hoffman also constructed a 114,000 SF central utility building to support both the new fab and a future fab.

Contract Type

CMGC, GMP

Client

Confidential Semiconductor Manufacturer

Architect

Jacobs

Location

Hillsboro, OR

Year

2003

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